Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on Substrate (CoWoS) packaging at Taiwan Semiconductor Manufacturing Co (NYSE:TSM). Industry insiders see FOPLP as a viable alternative to CoWoS due to TSMC’s limited CoWoS capacity and the rising demand for AI chips driven by generative AI applications. A senior executive from China Wafer Level CSP sta
A London biotech business co-founded by Britain’s vaccine tsar Kate Bingham has been bought for $3bn (£2.36bn), in a deal bosses claimed could revolutionise the treatment of blindness.
Two British backpackers were left in tears after a cobra and thousands of moths swarmed their hotel room in Thailand.