Applied Materials developed a new materials engineering solution called the Endura Copper Barrier Seed IMS by combining seven different process technologies in one system under a high vacuum.
It eliminated the high-resistivity barrier via the interface.
The solution included copper reflow technology that enabled void-free gap fill in narrow features.
It helped to reduce electrical resistance at the via contact interface by up to 50%.
It improved chip performance and power consumption and enabled logic scaling to continue to 3nm and beyond.
Price action: AMAT shares traded higher by 0.25% at $138.99 in the market session on the last check Wednesday.
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